Plan the manufacturing route
Ultra-high-density interconnect designs extend fine-feature routing beyond conventional subtractive PCB processes. The process choice may include semi-additive approaches, but its suitability depends on the complete material and interconnect system. Evaluate the actual production capability and qualification evidence before fixing design rules.
Start from the package interface
Fine-pitch component escape, pad geometry and registration drive the interconnect architecture. Ask for production design rules for the intended process rather than relying on a demonstration feature size.
Review the full process chain
Copper formation, dielectric preparation, via construction and surface finish must work together. Assembly yield can be limited by pad geometry and coplanarity even when bare-board routing is feasible.
Plan a qualification build
Use representative structures and an agreed acceptance plan to validate the proposed stack-up. Include thermal and mechanical conditions that match the application.
Before you request a quote
- Identify the routing problem that conventional HDI cannot solve.
- Obtain material and process-specific rules.
- Align board fabrication with assembly capability.
- Require evidence for the selected production construction.
For a build-specific review, provide the actual revision, quantity and delivery requirement. Manufacturing limits, applicable certifications and lead time must be confirmed in the written quotation.