Plan the manufacturing route
High-density interconnect construction uses smaller interconnect features and microvias to route dense component layouts. HDI should solve a routing or packaging requirement, not simply add complexity. Start by establishing the component escape strategy and then evaluate the number of build-up layers and lamination cycles it requires.
Select the via architecture
Blind, buried and through vias serve different layer transitions. Staggered and stacked microvia structures have different process and reliability considerations. Require the chosen architecture to be reviewed as a complete stack-up.
Consider the assembly surface
Via-in-pad structures may need filling and planarization to provide an appropriate soldering surface. Pad flatness and solder-paste behavior matter alongside electrical connectivity.
Define reliability evidence
Agree acceptance criteria and any thermal-stress or cross-section evaluation. The smallest manufacturable feature is not automatically the preferred production design rule.
Before you request a quote
- Supply the BGA pitch and escape-layer requirements.
- Identify microvia layer spans and via filling requirements.
- Confirm build-up materials and lamination sequence.
- Budget for process qualification when the construction is new.
For a build-specific review, provide the actual revision, quantity and delivery requirement. Manufacturing limits, applicable certifications and lead time must be confirmed in the written quotation.