Plan the manufacturing route
Rigid printed circuit boards use a mechanically stable laminate system to support copper interconnects and mounted components. The fabrication drawing must describe the finished board, including dimensions, tolerances, thickness and any controlled electrical requirements. A well-specified conventional construction is often more predictable than an unnecessarily complex one.
Choose the stack-up before routing
Signal-reference relationships, power distribution and manufacturable dielectric thicknesses affect the layer structure. Ask for a proposed stack-up before final impedance-controlled routing.
Specify copper deliberately
Starting foil and finished outer-layer copper are different quantities. Plating changes outer-layer geometry, while heavy copper changes etching, spacing and thermal design considerations.
Match the finish to assembly
Surface-finish selection depends on solderability, storage, contact requirements and component pitch. State any special requirements for edge contacts separately from general solderable pads.
Before you request a quote
- Provide a dimensioned outline and slot definitions.
- Specify finished hole sizes and relevant tolerances.
- Identify controlled-impedance nets and coupon requirements.
- Agree electrical testing and any microsection records.
For a build-specific review, provide the actual revision, quantity and delivery requirement. Manufacturing limits, applicable certifications and lead time must be confirmed in the written quotation.