1. List the interfaces and constraints
Identify fast digital channels, RF routes, power rails, isolation boundaries and mechanical thickness limits. Use those requirements to decide which layers need continuous references and which sections need special materials.
2. Propose the routing and plane arrangement
Place signal layers near suitable reference conductors and review how return current follows each important route. Consider transitions between layers, connector regions and plane splits. Keep the arrangement understandable enough to review before routing.
3. Request a manufacturable construction
Send the proposal to the intended fabricator with material, thickness and copper requirements. Available cores and prepregs, copper distribution and processing constraints can change the practical layer spacing.
4. Resolve controlled-impedance geometry
Approve the target structures, trace widths, pair spacing and dielectric information together. Review any manufacturer-adjusted geometry for compatibility with component escape and spacing constraints.
5. Release and verify
Keep the approved stack-up in the manufacturing package, identify any changes that require permission and agree coupon/report requirements. If materials or construction change on a repeat order, reassess the electrical assumptions.