Use these answers to prepare a clear project brief and resolve scope before a manufacturing release.
Can one build include SMT and through-hole parts?
Yes, the process plan can combine attachment methods. Component heat limits, board access and the order of operations determine whether selective soldering, wave soldering or a controlled manual process is appropriate. Identify press-fit and other special attachments separately.
How should DNP components be documented?
Keep every reference in the controlled design data and identify its fitted or do-not-populate status for the selected variant. Check that the BOM, assembly drawing and placement output agree. Removing a line without documenting the variant creates ambiguity.
What data is needed for component orientation?
Supply side and rotation in the placement file, supported by assembly drawings that show pin 1 and polarity. Rotation conventions vary between tools and packages; a first-article check should resolve orientation before the full lot is assembled.
How do I choose inspection?
Match inspection to potential defects. Optical inspection examines visible features, while hidden joints may need X-ray. Electrical and functional tests provide different coverage. Ask for a coverage statement, exclusions and the retained records.