Start from signal and power needs
Allocate routing layers and reference planes around the interfaces and power distribution requirements. A layer count chosen only to fit tracks may create poor return paths or an impractical power structure.
Use manufacturable materials
Dielectric thickness, copper distribution and available core/prepreg systems affect the construction. Request a fabrication proposal before finalizing trace geometry, especially when controlled impedance or mixed materials are involved.
Record the finished construction
The approved stack-up should identify layer order, material system, copper, dielectric spacing and finished thickness. Define which changes require design approval and how impedance verification will be reported.
Prepare the review package
- Layer order and signal-reference relationships
- Material and finished-thickness requirements
- Impedance targets and relevant net classes
- Fabricator-approved stack-up drawing